StructuredGround GB2B0312TPI-1 Telecom Grounding Busbar 0312 Copper Tin-Plated PANDUIT GB2B0312TPI-1
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Product Information
Specification
| Sub Brand : | StructuredGround™ |
| Material: | Copper |
| Overall Length (In.): | 20 |
| Overall Length (mm): | 508 |
| Overall Width (In.) : | 2 |
| Overall Width (mm) : | 50.8 |
| Overall Height (In.) : | 2.75 |
| Overall Height (mm): | 69.9 |
| Stud Hole Size (In.): | 0.31 |
| Stud Hole Size (mm): | 7.87 |
| Finish/Coating: | Tin-Plated |
| Overall Thickness (In.): | 0.25 |
| Overall Thickness (mm): | 6.4 |
| Standards Met: | BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment |
| Application: | Telecom/Data Center |
| Product Type: | Grounding Busbar |
| Part Features: | Available with a variety of hole pattern spacing options, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation |
| UPC: | 07498365929 |
| Product Number: | GB2B0312TPI-1 |
StructuredGround GB2B0312TPI-1 Telecom Grounding Busbar 0312 Copper Tin-Plated PANDUIT GB2B0312TPI-1
Description:
• The GB2B0312TPI-1 Grounding Busbar meets BICSI and ANSI/TIA-607-D requirements for network systems grounding applications. Made of high-conductivity copper and tin-plated to inhibit corrosion, comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use Panduit self-laminating laser/inkjet labels to identify busbars.
Features:
• Meet BICSI and TIA-607-B requirements for network systems grounding applications
• Made of high-conductivity copper and tin-plated to inhibit corrosion
• Come pre-assembled with brackets and insulators attached for quick installation
• Use Panduit component labels, sold separately, to identify busbars to meet TIA/EIA-606-A, see chart below
Download PDF Spec Sheet
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