StructuredGround GB2B0304TPI-1 Telecom Grd Busbars 0304 Copper Tin-Plated PANDUIT GB2B0304TPI-1
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Specification
| Sub Brand: | StructuredGround™ |
| Material: | Copper |
| Overall Length (In.): | 10 |
| Overall Length (mm): | 254 |
| Overall Width (In.): | 2 |
| Overall Width (mm): | 50.8 |
| Overall Height (In.): | 2.75 |
| Overall Height (mm): | 69.9 |
| Stud Hole Size (In.): | 0.44 |
| Stud Hole Size (mm): | 11.17 |
| Finish/Coating: | Tin-Plated |
| Overall Thickness (In.): | 0.25 |
| Overall Thickness (mm): | 6.4 |
| Standards Met: | BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment |
| Application: | Telecom/Data Center |
| Product Type: | Grounding Busbar |
| Part Features: | Available with a variety of hole pattern spacing options, Made of high conductivity copper and tin-plated to inhibit corrosion, Pre-assembled with brackets and insulators attached for quick installation |
| UPC: | 07498365926 |
| Std. Pkg. Qty: | 1 |
| Std. Pkg. Volume (cf): | 0.0030 |
| Std. Ctn. Qty: | 0 |
| Std. Ctn. Volume (cf): | 0.0000 |
| Part Number: | GB2B0304TPI-1 |
StructuredGround GB2B0304TPI-1 Telecom Grd Busbars 0304 Copper Tin-Plated PANDUIT GB2B0304TPI-1
Description:
The GB2B0304TPI-1 Grounding Busbar meets BICSI and ANSI/TIA-607-D requirements for network systems grounding applications. Made of high conductivity copper and tin-plated to inhibit corrosion, comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use Panduit self-laminating laser/inkjet labels to identify busbars.
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