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Replacement Blade for Bonded Semiconductor LCWB-FEP
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Product Information
Specification
About:
The LCWB-FEP is a replacement Spare blade for bonded semiconductor with chamfer 13°.
Also known as:
Stripping Tool, Chamfer Cutter, Semiconductor Bond Remover, Replacement Blade.
Specifications:
| Thickness Capacity | 1.8 mm / 0.071 inch |
| Angle of Chamfer |
13° |
| Part Number |
LCWB-FEP |
Benefits:
• No silicon needed
• Fine tuning of the blade with a 'click' for each 1/10 mm
• Very smooth finish over the insulation
• Adjustable length of semiconductor cutback : 25-30-40 mm / 0,984-1,181-1,575 in
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Call Us: 1-516-482-6313 Text Us: 1-516-703-3460