18 - 60 mm Bonded Semi-Conductor Stripping & Removal Tool CWB/18-60-FEP
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Product Information
Specification
About:
The CWB/18-60-FEP enables the user to easily remove the bonded semi-conductor with a chamfer on the transition, leaving a very smooth finish over the insulation. The CWB 18-60 works without silicone.
Semiconductor Cutback Stops: 0.984 - 1.181 - 1.575 inch (25 - 30 - 40 mm)
Also known as:
Stripping Tool, Chamfer Cutter, Semiconductor Bond Remover.
Specifications:
| Diameter Range |
0.709 - 2.362 inch / 18 – 60 mm |
| Thickness Capacity | 1.8 mm / 0.071 inch |
| Angle of Chamfer |
13° |
| Dimensions | 235 L x 125 W x 90 H mm |
| Weight | 1.87 lbs |
| Part Number |
CWB/18-60-FEP |
Benefits:
• No silicon needed
• Fine tuning of the blade with a 'click' for each 1/10 mm
• Very smooth finish over the insulation
• Adjustable length of semiconductor cutback : 25-30-40 mm / 0,984-1,181-1,575 in
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