Structured Ground™ Telecom Grd Busbars 0514 Copper Tin-Plated PANDUIT GB2B0514TPI-1
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Product Information
Specification
| Sub Brand | StructuredGround™ |
| Material | Copper |
| Overall Length (In.) | 24 |
| Overall Length (mm) | 609.6 |
| Overall Width (In.) | 2 |
| Overall Width (mm) | 50.8 |
| Overall Height (In.) | 2.75 |
| Overall Height (mm) | 69.9 |
| Finish/Coating | Tin-Plated |
| Overall Thickness (In.) | 0.25 |
| Overall Thickness (mm) | 6.4 |
| Resistance Properties | Corrosion-Resistant |
| Standards Met | BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment |
| Includes | Brackets and Insulators are attached for quick installation |
| Application | Telecom/Data Center |
| Product Type | Grounding Busbar |
Description:
The GB2B0514TPI-1 Grounding Busbar meets BICSI and ANSI/TIA-607-D requirements for network systems grounding applications. Made of high-conductivity copper and tin-plated to inhibit corrosion, comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use Panduit self-laminating laser/inkjet labels to identify busbars.
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